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PF (ADP1)
PRECISION SEMICONDUCTOR PRESSURE SENSOR
* A wide range of rated pressure, including a minute pressure There are 10 types of sensors covering a wide range of rated pressure from a minute pressure between 4.9 kPa {0.05 kgf/cm2}, to a maximum pressure of 980.7 kPa {10 kgf/cm2}. * Realization of highly accurate, linear characteristics This sensor employs a semiconductor strain gauge method, ensuring accurate and linear detection characteristics. It also has excellent repeatability of pressure characteristics. * Impressive line-up of models * Taking their place alongside the standard 5k bridge resistance models are those with a 3.3k resistance which is optimally suited to 5V drive circuits. * Economy model (no glass base) gives outstanding value for consumer appliances 40 kPa (0.4 kgf/cm2) and 49 kPa (0.5 kgf/cm2) units are also available.
PF PRESSURE SENSOR
Example of pressure characteristics (when the rated pressure is between 98.1 kPa {1.0 kgf/cm2}
Drive current: 1.5 mA rated current; ambient temperature: 25C 77F
100 Output voltage, mV
50

Silicon Piezo resistance strain gauge Anode junction Pressure Glass base
0
0 {0} 49 {0.5} 98.1 {1} Pressure (gauge pressure), (kPa {kgf/cm2})
TYPICAL APPLICATIONS
* Medical equipment: Electronic hemodynamometer * Home appliance: Vacuum cleaner * Gas equipment: Microprocessor gas meter, gas leakage detector * Industrial equipment: Absorption device, etc.
Highly reliable wire bonding technology Pressure
High reliability die bonding technology Very strong, heat resistant body
ORDERING INFORMATION
Ex. ADP
Part No. Terminal profile and direction
1: DIP terminal: Dirtection opposite the pressure inlet direction 0: 1: 2: 3: 4: 5: 6: 7: 8: 9: A:
1
Rated pressure
4.9 kPa 14.7 kPa 34.3 kPa 49.0 kPa 98.1 kPa 196.1 kPa 343.2 kPa 490.3 kPa 833.6 kPa 980.7 kPa 40.0 kPa {approx. 0.05 kgf/cm2} {approx. 0.15 kgf/cm2} {approx. 0.35 kgf/cm2} {approx. 0.5 kgf/cm2} {approx. 1.0 kgf/cm2} {approx. 2.0 kgf/cm2} {approx. 3.5 kgf/cm2} {approx. 5.0 kgf/cm2} {approx. 8.5 kgf/cm2} {approx. 10.0 kgf/cm2} {approx. 0.4 kgf/cm2}
ADP1: PF pressure sensor
2: DIP terminal: Pressure inlet direction
Type 1 : Standard type (With glass base) 2: Economy type (Without glass base)
Bridge resistance Nil : 5.0k 3 : 3.3k
Bridge resistance Terminal Pressure DIP terminal: Direction opposite the pressure inlet direction ADP1101 ADP1111 ADP1121 ADP1131 ADP1141 ADP1151 ADP1161 ADP1171 ADP1181 ADP1191 ---- ADP1132
5.0k DIP terminal: Pressure inlet direction ADP1201 ADP1211 ADP1221 ADP1231 ADP1241 ADP1251 ADP1261 ADP1271 ADP1281 ADP1291 ---- ADP1232 DIP terminal: Direction opposite the pressure inlet direction ---- ---- ---- ---- ---- ---- ---- ---- ---- ---- ADP11A23 ----
3.3k DIP terminal: Pressure inlet direction ---- ---- ---- ---- ---- ---- ---- ---- ---- ---- ADP12A23 ----
4.9kPa 14.7kPa 34.3kPa Standard type (With glass base) 49.0kPa 98.1kPa 196.1kPa 343.2kPa 490.3kPa 833.6kPa 980.7kPa Economy type (Without glass base) 40.0kPa 49.0kPa
approx. 0.05kgf/cm2 approx. 0.15kgf/cm2 approx. 0.35kgf/cm approx. 0.5kgf/cm2 approx. 1.0kgf/cm2 approx. 2.0kgf/cm2 approx. 3.5kgf/cm
2 2
approx. 5.0kgf/cm2 approx. 8.5kgf/cm2 approx. 10.0kgf/cm2 approx. 0.4kgf/cm
2
approx. 0.5kgf/cm2
27
PF (ADP1)
SPECIFICATIONS
Type Type of pressure Pressure medium Unit: kPa Rated pressure Unit: kgf/cm2 (approx.) Max. applied pressure Bridge resistance Ambient temperature Storage temperature Temperature compensation range Drive current (constant current) Output span voltage Offset voltage Linearity Pressure hysteresis Offset voltage-temperature characteristics (0 to 50C 32 to 122F) Sensitivity-temperature characteristics (0 to 50C 32 to 122F) 4020 mV 0.7%FS 0.5%FS 0.6%FS 0.4%FS 15%FS 10%FS Standard type (With glass base) (Without glass base) Gauge pressure Air (For other medium, please consult us.) 34.3 49.0 98.1 196.1 343.2 490.3 833.6 980.7 40.0 49.0 0.35 0.5 1.0 2.0 3.5 5.0 8.5 10.0 0.4 0.5 Twice the rated pressure 1.5 times the rated pressure Twice the rated pressure 50001000 3300600 50001000 -5 to 50C -20 to 100C -20 to 100C -4 to 212F (no freezing or condensation) -7 to 122F -4 to 212F -20 to 70C -40 to 120C -40 to 120C -40 to 248F (no freezing or condensation) -4 to 158F -70 to 248F 5 to 45C 0 to 50C 0 to 50C 32 to 122F 41 to 113F 32 to 122F 1.5 mA DC 10040 mV 43.522.5 mV 8545 mV 20 mV 15 mV 25 mV 0.3%FS 0.5%FS 0.6%FS 0.3%FS 0.2%FS 0.4%FS 0.7%FS 5.0%FS 2.5%FS 10%FS 8%FS
Economy type
4.9 0.05
14.7 0.15
1.3%FS 2.5%FS
Notes) 1. Unless otherwise specified, measurements were taken with a drive current of1.5 mA 0.01 mA at a temperature of 25C 77F and humidity ranging from 25% to 85%. 2. Please consult us if a pressure medium other than air is to be used. 3. This is the regulation which applies within the compensation temperature range. 4. Please consult us if the intended use involves a negative pressure.
DATA
1. Characteristics data 1-<1> Output characteristics
ADP1141 Drive current: 1.5 mA; temperature: 25C 77F
100 80 60 40 20 0 -20 -40
1-<2> Offset voltage - temperature characteristics
ADP1141 Drive current: 1.5 mA; rating 5%FS
Offset voltage - temperature characteristics (%FS) 4 3
1-<3> Sensitivity - temperature characteristics (%FS)
ADP1141 Drive current: 1.5 mA; rating 2.5%FS
4 Sensitivity - temperature characteristics (%FS) 3
Output voltage (mV)
2
2
1
1
0
0
-1
-1
0
49 {0.5} kpa {kgf/cm2}
98.1 {1} Rated pressure
-2
0 32
25 47
50 122 Temperature (C F)
-2
0 32
25 47
50 122 Temperature (C F)
2. Pressure cycle range (0 to rated pressure)
Tested sample: ADP1131, temperature: 25C 77F
2-<1> Offset voltage range
2
2-<2> Output span voltage range
2
1
Output span voltage range (%FS)
Even after testing for 1 million times, the variations in the offset voltage and output span voltage are minimal.
Offset voltage range (%FS)
1
0
0
-1
-1
-2
0
1x105
5x105 1x106
-2
0
1x105
5x105 1x106
Pressure cycle (cycle)
Pressure cycle (cycle)
28
PF (ADP1)
3. Evaluation test
Tested item Storage at high temperature Storage at low temperature Environmental characteristics Humidity Temperature cycle Endurance characteristics High temperature/high humidity operation Vibration resistance Mechanical characteristics Tested condition Temperature: Left in a 120C 248F constant temperature bath Time: 1,000 hrs. Temperature: Left in a -40C -40F constant temperature bath Time: 1,000 hrs. Temperature/humidity: Left at 40C 104F, 90% RH Time: 1,000 hrs. Temperature: -40C to 120C -40F to 248F 1 cycle: 30 min. Times of cycle: 100 Temperature/humidity: 40C 104F, 90% RH Operation times: 106, rated voltage applied Double amplitude: 1.5 mm .059 inch Vibration: 10 to 55 Hz Applied vibration direction: X, Y, Z 3 directions Times: 2 hrs each Dropping height: 75 cm 29.528 inch Times: 2 times Pulling strength: 9.8 N {1 kgf}, 10 sec. Bending strength: 4.9 N {0.5 kgf}, left and right 90 1 time Temperature: 230C 446F Time: 5 sec. Temperature: 260C 500F Time: 10 sec. Result Passed Passed Passed Passed Passed
Passed
Dropping resistance Terminal strength
Passed Passed Passed Passed
Soldering Resistance
Soldered in DIP soldering bath Temperature
Note: For details other than listed above, please consult us.
DIMENTIONS
1. Terminal direction: Direction opposite the pressure inlet derection ADP11 ()
Atmospheric pressure inlet hole 0.5 dia. .020 dia. 8.6 .339 10.0 .394
General tolerance: 0.3 .012 mm inch
2. Terminal direction: Pressure inlet direction ADP12 ()
Atmospheric pressure inlet hole 0.5 dia. .020 dia. 8.6 .339 10.0 .394
3.0 +0 dia. -0.1 .118 +0 dia. -.004
Pressure inlet hole 0.8 dia. .031 dia.
10.16 0.25 .400 .010 C0.5 .020 1.2 0.1 .047 .004 0.5 0.1 .020 .004 0.6 .024
2.54 0.25 2.54 0.25 .100 .010 .100 .010
Pressure inlet hole 0.8 dia. .031 dia. 0 to 15 0.25 +0.1 -0.05 .010 +.004 -.002
3.0 +0 dia. -0.1 .118 +0 dia. -.004 C0.5 .020
6.0 .236
R0.5 .020
3.3 .130 1.1 .043 4.9 0.6 .024 .193 0.5 .020 1.2 0.1 .047 .004 2.54 0.25 2.54 0.25 .100 .010 .100 .010
0.1 .004
6.0 4.0 .236 .157 3.3 .130
R0.5 .020
0.25 +0.1 -0.05 .010 +.004 -.002 0 to 15
0.25 .010
10.16 0.25 .400 .010
Recommended PC board pattern (BOTTOM VIEW)
6-0.9 dia. 6-.035 dia. 10.16 .400 2.54 .100 5.08 .200 2.54 .100
Recommended PC board pattern (BOTTOM VIEW)
6-0.9 dia. 6-.035 dia. 10.16 .400 2.54 .100
6 dia. .236 dia. 2.54 .100 5.08 .200
Tolerance: 0.1 .004
Tolerance: 0.1 .004
3. Terminal connection diagram
+Input
Terminal No. 1
R1 -Output
Name Output (-) Power supply (+) Output (+) No connection Power supply (-) Output (-)
R2 +Output R3
2 3 4 5 6
R4
-Input
Note: Leave terminal 4 unconnected.
29
PF (ADP1)
NOTES
1. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed. 2. Soldering 1) Due to its small size, the thermal capacity of the pressure sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Dip soldering bath: Max. 260C 500F, 5 sec. Soldering iron: 260 to 300C 500 to 572F (30W) within 5 sec. 2) Use a non-corrosive resin type of flux. Since the pressure sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. 3. Cleaning 1) Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. 2) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring. 4. Environment Consult with us before using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfites, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip. 5. Quality check under actual loading conditions 1) To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 2) As for test data, please contact us. 6. Other handling precautions 1) That using the wrong pressure range or mounting method may result in accidents. 2) Air can be used directly as a pressure medium. Consult with us before using a corrosive gas (such as a gas given off by an organic solvent, sulfite or hydrogen sulfide) as the pressure medium. 3) The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric pressure inlet is blocked. 4) Leave pin No. 4 unconnected since the pressure sensor chip may be damaged if a voltage is applied to this pin. 5) Use an operating pressure which is within the rated pressure range. Using a pressure beyond this range may cause damage. 6) Since this pressure sensor chip does not have a water-proof construction, consult with us if it is to be used in a location where it may be sprayed with water, etc. 7) Avoid using the pressure sensor chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. 8) The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when pressure is to be applied by means of a transparent tube, take steps to prevent the pressure sensor chip from being exposed to light. 9) Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration. 10) Since static charge can damage the pressure sensor chip, bear in mind the following handling precautions. * When storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. * When using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 11) Due to the pressures involved, give due consideration to the securing of the pressure sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries.
APPLICATION CIRCUIT DIAGRAM (EXAMPLE)
The pressure sensor is designed to convert a voltage by means of constant current drive and then, if necessary, it amplifies the voltage for use. The circuit shown below is a typical example of a circuit in which the pressure sensor is used.
Constant current circuit unit
Pressure sensor
MOUNTING METHOD
The general method for transmitting air pressures differs depending on whether the pressure is low or high. * Checkpoints for use <1> Select a pressure inlet pipe which is sturdy enough to prevent pressure leaks. <2> Fix the pressure inlet pipe securely so as to prevent pressure leaks. <3> Do not block the pressure inlet pipe. Methods of transmitting air pressures
When the pressure is low (4.9 to 98.1 kPa)
Printedcircuit board
When the pressure is high (196.1 to 980.7 kPa)
Printedcircuit board
O-ring Tube Pressure inlet pipe
Amplifier circuit unit
If a tube is used as the pressure inlet pipe, it may become disengaged. Therefore, use a sturdy tube and secure it using O-rings.
OP AMP
OP AMP OP AMP
12/1/2002
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